Paper Title:
Investigation of the Effect of Crack Closure Stress on Microwave Dual Frequency Technique for Evaluation of Small Cracks
  Abstract

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Periodical
Key Engineering Materials (Volumes 270-273)
Edited by
Seung-Seok Lee, Dong-Jin Yoon, Joon-Hyun Lee and Sekyung Lee
Pages
913-920
DOI
10.4028/www.scientific.net/KEM.270-273.913
Citation
M. Saka, T. Miyadu, Y. Ju, "Investigation of the Effect of Crack Closure Stress on Microwave Dual Frequency Technique for Evaluation of Small Cracks", Key Engineering Materials, Vols. 270-273, pp. 913-920, 2004
Online since
August 2004
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