Paper Title:
Elastoplastic Singular Behavior of Residual Stress in Si3N4/S45C Joint with Copper Interlayer
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Periodical
Key Engineering Materials (Volumes 274-276)
Edited by
W.P. Shen and J.Q. Xu
Pages
1011-1016
DOI
10.4028/www.scientific.net/KEM.274-276.1011
Citation
L. D. Fu, Y. Miyashita, Y. Mutoh, "Elastoplastic Singular Behavior of Residual Stress in Si3N4/S45C Joint with Copper Interlayer ", Key Engineering Materials, Vols. 274-276, pp. 1011-1016, 2004
Online since
October 2004
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