Paper Title:
A Microscopic Mechanics Model for Thermal Fatigue Crack Growth
  Abstract

  Info
Periodical
Key Engineering Materials (Volumes 274-276)
Edited by
W.P. Shen and J.Q. Xu
Pages
205-210
DOI
10.4028/www.scientific.net/KEM.274-276.205
Citation
Y. Sun, R. Zhang, J. Ma, "A Microscopic Mechanics Model for Thermal Fatigue Crack Growth", Key Engineering Materials, Vols. 274-276, pp. 205-210, 2004
Online since
October 2004
Authors
Export
Price
$32.00
Share

In order to see related information, you need to Login.

In order to see related information, you need to Login.