Paper Title:
An Environmental-Friendly Ni-Electroplating onto Cu at a Supercritical State
  Abstract

Electroplating using a Ni-plating solution/CO2 macroemulsion was carried out at a supercritical condition. This method is that the Ni+2 ions in the macroemulsion using a surfactant have been deposited onto Cu. For forming the macroemulsion, we synthesized the fluorocarbonhydrocarbon surfactants, that is, sodium salt of bis (2,2,3,3,4,4,5,5-octafluoro-1-pentanol) sulfosuccinate with both ‘CO2 philic’ chains and the ‘hydrophilic' head group. The Cu plate, screw and chip as complicated shaped metals were plated by using this method. And the plated ware performed by this method was compared with that performed by the conventional method (electroplating at 1atm) to evaluate the effectiveness of the effective plating process.

  Info
Periodical
Key Engineering Materials (Volumes 277-279)
Edited by
Kwang Hwa Chung, Yong Hyeon Shin, Sue-Nie Park, Hyun Sook Cho, Soon-Ae Yoo, Byung Joo Min, Hyo-Suk Lim and Kyung Hwa Yoo
Pages
397-402
DOI
10.4028/www.scientific.net/KEM.277-279.397
Citation
J. Y. Park, J. D. Kim, Y. W. Lee, J. S. Lim, "An Environmental-Friendly Ni-Electroplating onto Cu at a Supercritical State", Key Engineering Materials, Vols. 277-279, pp. 397-402, 2005
Online since
January 2005
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