Paper Title:
Wettability of SiC/Ag Plus Ti System
  Abstract

Wettability of ceramics by liquid metals is of importance for joining of ceramics to metals and manufacturing of cermets. Wettability of reaction bonded SiC /Ag plus Ti system was studied. The contact angle was determined by high temperature photography. The microstructure and composition of the interfacial region were analyzed. For SiC/pure Ag system, the contact angle at 998°C in vacuum is 128.4º. The wettability of the system is remarkably improved by adding Ti into the metallic filler. Also, the contact angle of the system is strongly affected by the wetting temperature and the dwelling time. The results indicate that interfacial reactions take place during the test, and the reactions facilitate the wetting. Microstructural study reveals that inter-diffusion takes place and a reaction layer forms at the interface.

  Info
Periodical
Key Engineering Materials (Volumes 280-283)
Edited by
Wei Pan, Jianghong Gong, Chang-Chun Ge and Jing-Feng Li
Pages
1795-1800
DOI
10.4028/www.scientific.net/KEM.280-283.1795
Citation
S. J. Li, H. L. Liu , J. J. Zhang, "Wettability of SiC/Ag Plus Ti System", Key Engineering Materials, Vols. 280-283, pp. 1795-1800, 2005
Online since
February 2007
Export
Price
$32.00
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