Paper Title:
Study of the Technology of Chemical Copper Plating on Al-CuO Agglomerated Powders
  Abstract

This research focus on the technology of copper chemical plating on Al-CuO agglomerated powders with the size of 150-200µm. Orthogonal design is employed to gain the optimized formula, and the quality of the cladding was analyzed by means of SEM and EPMA. The results show that the cladding is uniform and the Al-CuO powders are primarily coated by copper.

  Info
Periodical
Key Engineering Materials (Volumes 280-283)
Edited by
Wei Pan, Jianghong Gong, Chang-Chun Ge and Jing-Feng Li
Pages
591-592
DOI
10.4028/www.scientific.net/KEM.280-283.591
Citation
J. Yan, J. Z. Yi, H. P. Cui, X. K. Du, J. J. Wang, "Study of the Technology of Chemical Copper Plating on Al-CuO Agglomerated Powders", Key Engineering Materials, Vols. 280-283, pp. 591-592, 2005
Online since
February 2007
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Price
$32.00
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