Paper Title:
Static and Dynamic Indentation Damage in SiC and Si3N4
  Abstract

Hertzian and explosive indentations were used to determine the damage behavior of SiC and Si3N4 ceramics. Specimens were selected with different microstructures. In order to observe the subsurface damaged zone, the bonded interface technique was adopted. It was found that the damage response depends strongly on the microstructure of ceramics. Examination of subsurface damage reveals a competition between brittle and quasiplastic damage mode: brittle fracture mode is dominant in fine grain microstructure; quasiplastic deformation occurs in coarse grain. Dynamic indentation induces subsurface yield zone which contains extensive micro-cracks. The role of microstructure on static and dynamic damage behavior are discussed in terms of the weakness of grain boundary and grain size.

  Info
Periodical
Edited by
Hai-Doo Kim, Hua-Tay Lin and Michael J. Hoffmann
Pages
410-415
DOI
10.4028/www.scientific.net/KEM.287.410
Citation
J. H. Kim, Y. G. Kim, D. K. Kim, K. S. Lee, S. N. Chang, "Static and Dynamic Indentation Damage in SiC and Si3N4", Key Engineering Materials, Vol. 287, pp. 410-415, 2005
Online since
June 2005
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$32.00
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