Paper Title:
Effect of Grain Boundary Phase on Contact Damage Resistance of Silicon Nitride Ceramics
  Abstract

Contact damage resistances of silicon nitride ceramics with various grain boundary phases are investigated in this study. The grain boundary phases are controlled by the addition of different types of sintering additives, or the crystallization of intergranular phase in a silicon nitride. We control the microstructures of materials to have similar grain sizes and the same phases to each other. Contact testing with spherical indenters is used to characterize the damage response. The implication is that the grain boundary phase can be another controllable factor against contact damage and strength degradation even though it is not critical relative to the effect of grain morphology.

  Info
Periodical
Edited by
Hai-Doo Kim, Hua-Tay Lin and Michael J. Hoffmann
Pages
421-426
DOI
10.4028/www.scientific.net/KEM.287.421
Citation
C. S. Lee, K. S. Lee, S. W. Lee, D. K. Kim, "Effect of Grain Boundary Phase on Contact Damage Resistance of Silicon Nitride Ceramics ", Key Engineering Materials, Vol. 287, pp. 421-426, 2005
Online since
June 2005
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Price
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