Paper Title:
Detection of Cracks Using Piezoelectric Wafer Active Sensors
  Abstract

The capability of piezoelectric wafer active sensors to identifying cracks which are common to metallic structural elements subjected to fatigue loading were explored. A number of laboratory tests were performed to investigate Lamb wave transmission and reception characteristics as well as the sensitivity of the transmitted and reflected signals to the presence of a through-the-thickness crack of various length and orientation in a thin plate. Based on the laboratory tests an optimum strategy for crack detection with the pulse-echo method was investigated. The method can be used for large areas scanning with a small amount of sensors and is favoured for embedded and leave-in-place sensor applications.

  Info
Periodical
Key Engineering Materials (Volumes 293-294)
Edited by
W.M. Ostachowicz, J.M. Dulieu-Barton, K.M. Holford, M. Krawczuk and A. Zak
Pages
201-206
DOI
10.4028/www.scientific.net/KEM.293-294.201
Citation
A. Blazewicz, A. Kotousov, F. Wornle, "Detection of Cracks Using Piezoelectric Wafer Active Sensors ", Key Engineering Materials, Vols. 293-294, pp. 201-206, 2005
Online since
September 2005
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Price
$32.00
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