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Measurement Technology and Intelligent Instruments VI

Volumes 295 - 296
doi: 10.4028/www.scientific.net/KEM.295-296
Paper Titles published in this Main Theme:
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Laser Scattering Measurement of Microdefects on Silicon Oxide Wafer

Authors: Taeho Ha, Takashi Miyoshi, Yasuhiro Takaya, S. Takahashi

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Characterisation of Surface Properties by a Multi-Function TPM

Authors: Xian Ping Liu, J. Zhang

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Development of an Evanescent Light Measurement System for Si Wafer Microdefect Detection

Authors: S. Takahashi, R. Nakajima, Takashi Miyoshi, Yasuhiro Takaya, Kiyoshi Takamasu

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An Embedded FBG Sensor for Dynamic Strain Measurement for a Clamped-Clamped Composite Structure

Authors: Hang Yin Ling, Alan Kin Tak Lau, Li Cheng, J. Wei, R.S. Thomson, M.L. Scott

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A Thermovision Method for Studying Deformation Kinetics of Materials and Structure Elements

Authors: Evgeny S. Lukin, Alexander M. Ivanov

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Damage Detection of Composite Structures Using Dynamic Analysis

Authors: L.H. Yam, Li Cheng, Z. Wei, Y.J. Yan

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Investigation of Nonisothermal Crystallization Behaviors of Poly and Silica Nanocomposites Using Differential Scanning Calorimetry

Authors: Ling Xue Kong, Z. Peng

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Ellipsometric Detection of Transitional Surface Structures on Decapped GaAs(001)

Authors: A.V. Vasev, S.I. Chikichev

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Temperature Effect on the Stability of CuO Nanofluids Based on Measured Particle Distribution

Authors: Ho Chang, Chih Hung Lo, Tsing Tshih Tsung, Y.Y. Cho, D.C. Tien, Liang Chia Chen, C.H. Thai

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Determination of Young's Modulus of Micromechanical Silicon Films Using an Acoustic Excitation and Optical Detection Resonance Method

Authors: Y.M. Liu, W.J. Tian, S.J. Zhang

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