Paper Title:
Development of an Evanescent Light Measurement System for Si Wafer Microdefect Detection
  Abstract

In order to reduce and control yield loss in the fabrication process of next generation ULSI devices, nano-defects inspection technique for polished Silicon (Si) wafer surface becomes more essential. This paper discusses a new optical nano-defects detection method, which is applicable to silicon wafer surface inspection for next-generation semiconductors. In our proposed method, the evanescent light is emerged on the wafer surface with total internal reflection (TIR) of infrared (IR) laser at the Si-air interface. By scanning the surface where the evanescent light is emerging with a very shaped fiber probe, it enables to detect nanometer scale defects in the vicinity of Si wafer surface without diffraction limit to resolution. To experimentally verify the feasibility of this method, an evanescent light measurement system was developed and several fundamental experiments were performed. The results show that the proposed Si wafer microdefects detection method can detect the microdefect with 10nm scale on and beneath the surface based on evanescent light distribution.

  Info
Periodical
Key Engineering Materials (Volumes 295-296)
Edited by
Yongsheng Gao, Shuetfung Tse and Wei Gao
Pages
15-20
DOI
10.4028/www.scientific.net/KEM.295-296.15
Citation
S. Takahashi, R. Nakajima, T. Miyoshi, Y. Takaya, K. Takamasu, "Development of an Evanescent Light Measurement System for Si Wafer Microdefect Detection", Key Engineering Materials, Vols. 295-296, pp. 15-20, 2005
Online since
October 2005
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Price
$32.00
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