Paper Title:
Reliability Analysis of ACF Interconnection Assembly Process Using FEM
  Abstract

Anisotropic conductive film (ACF) is commonly used as underfill for flip chip assembly. The present study focuses on elastic recovery and stress distribution along the interfaces of particle-pads and underfill-pads associated with heat or a mechanical loading. In the same manner as the experimental process for ACF assemblies, ACF interconnection is simulated using FEM. Firstly, the properties of the nickel were determined by fitting FEM to the experimental results. After that, the nickel properties are used for ACF interconnection analysis. We found that delamination may also occur at a three-joint interface of a particle, a pad and an underfill at the lowest temperature during a heat cycle.

  Info
Periodical
Key Engineering Materials (Volumes 297-300)
Edited by
Young-Jin Kim, Dong-Ho Bae and Yun-Jae Kim
Pages
1828-1833
DOI
10.4028/www.scientific.net/KEM.297-300.1828
Citation
H. Koguchi, W. Attaporn, K. Nishida, "Reliability Analysis of ACF Interconnection Assembly Process Using FEM ", Key Engineering Materials, Vols. 297-300, pp. 1828-1833, 2005
Online since
November 2005
Export
Price
$32.00
Share

In order to see related information, you need to Login.

In order to see related information, you need to Login.

Authors: Hyun Wook Nam
Abstract:The use of flip-chip technology has many advantages over other approaches for high-density electronic packaging. ACF (anisotropic conductive...
1049
Authors: Jun Zhang, Yong Cheng Lin, Xin Li Wei, Liu Gang Huang
Abstract:A modified cohesive zone interface model with a damage factor was proposed to describe the effects of the thermal cycle and humidity aging on...
1928