Mechanical Properties of Photosensitive Polyimide Film by Nanoindentation and Microtensile Test |
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| Journal | Key Engineering Materials (Volumes 297 - 300) |
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| Volume | Advances in Fracture and Strength |
| Edited by | Young-Jin Kim, Dong-Ho Bae and Yun-Jae Kim |
| Pages | 237-243 |
| DOI | 10.4028/www.scientific.net/KEM.297-300.237 |
| Citation | Shin Hur et al., 2005, Key Engineering Materials, 297-300, 237 |
| Online since | November, 2005 |
| Authors | Shin Hur, Sung In Hong, Dong Kil Shin |
| Keywords | Mechanical Properties, Microtensile Test, Nanoindentation, Polyimide, Thin Film |
| Abstract | A free-standing photosensitive polyimide film with thickness of 10µm is fabricated with the different curing temperatures using a micro fabrication process. The microtensile specimens of a strip type are made to facilitate a tensile testing. The Young’s modulus and yield strength of photosensitive polyimide film are measured with various strain rates from 10-4 /s to 10-3 /s by using a microtensile test. Also, the hardness and Young’s modulus of polyimide films are obtained from nanoindentation test. Finally, the mechanical properties measured from microtensile test are compared with those from nanoindentation test. |
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