Paper Title:
A New Specimen for Measuring the Interfacial Toughness of Al-0.5%Cu Thin Film on Si Substrate
  Abstract

A new specimen is proposed to measure the interfacial toughness between the Al-0.5%Cu thin film and the Si substrate. The plain and general micro-fabrication processes are sufficient to fabricate the specimen. With the help of the finite element method and the concepts of the linear elastic fracture mechanics, the detailed structure for this specimen is modeled and evaluated. The results obtained from this research show that the proposed specimen provides efficient and convenient method to measure the interfacial toughness between the Al-Cu thin film and the Si substrate.

  Info
Periodical
Key Engineering Materials (Volumes 297-300)
Edited by
Young-Jin Kim, Dong-Ho Bae and Yun-Jae Kim
Pages
521-526
DOI
10.4028/www.scientific.net/KEM.297-300.521
Citation
I. Jeon, M. Omiya, H. Inoue, K. Kishimoto, T. Asahina, "A New Specimen for Measuring the Interfacial Toughness of Al-0.5%Cu Thin Film on Si Substrate ", Key Engineering Materials, Vols. 297-300, pp. 521-526, 2005
Online since
November 2005
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Price
$32.00
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