Paper Title:
Measurement of Continuous Micro-Tensile Strain Using Micro-ESPI Technique
  Abstract

To determine the micro-mechanical properties for micro/nano materials, it may be essential to measure the strain/deformation during micro-mechanical testing. Therefore, in this study, continuous measurement of in-plane tensile strain in micro-sized specimens of thin film materials was introduced using the micro-ESPI technique. TiN and Au thin films 1 and 0.47µm thick, respectively, were deposited on the silicon wafer and fabricated into the micro-sized tensile specimens by the electromachining process. The micro-tensile loading system and micro-ESPI system were developed to measure the tensile strain during micro-tensile loading. Micro-tensile stress-strain curves for these materials were determined using the algorithm for continuous strain measurement. Furthermore, the new algorithm for enhancing the sensitivity to measurement of in-plane tensile strain was suggested. Using the algorithm, micro-tensile strain data between interfringes were calculated. It is shown that the algorithm for enhancement of the sensitivity suggested in this study makes the sensitivity to the in-plane tensile strain increase.

  Info
Periodical
Key Engineering Materials (Volumes 297-300)
Edited by
Young-Jin Kim, Dong-Ho Bae and Yun-Jae Kim
Pages
53-58
DOI
10.4028/www.scientific.net/KEM.297-300.53
Citation
Y. H. Huh, D. I. Kim, C. D. Kee, "Measurement of Continuous Micro-Tensile Strain Using Micro-ESPI Technique ", Key Engineering Materials, Vols. 297-300, pp. 53-58, 2005
Online since
November 2005
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Price
$32.00
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