Paper Title:
The Study on Fatigue Life of Interconnect with Respect to Geometrical Shape of Supporting Structure and Load Conditions in MEMS
  Abstract

Recently, application of semiconductor sensors has widely spreaded into various industries becasuse those have several merits like easy miniaturization and batch production etc. But external conditions such as thermal and repetitive load have a bad effect on sensors’s lifetime. Therefore, lots of studies related with the fatigue of microelectromechnical systems (MEMS) have been conducted. Especially, this paper was focused on fatigue life of aluminum interconnect in the supporting structure of sensor under cyclic thermal load and on the approximation equation defining the critical temperature to ensure required operating life using FEM simulation.

  Info
Periodical
Key Engineering Materials (Volumes 297-300)
Edited by
Young-Jin Kim, Dong-Ho Bae and Yun-Jae Kim
Pages
539-544
DOI
10.4028/www.scientific.net/KEM.297-300.539
Citation
J. J. Shim, G. J. Han, K. Y. Kim, D. P. Yun, C. H. Ok, S. S. Lee, "The Study on Fatigue Life of Interconnect with Respect to Geometrical Shape of Supporting Structure and Load Conditions in MEMS ", Key Engineering Materials, Vols. 297-300, pp. 539-544, 2005
Online since
November 2005
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Price
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