Paper Title:
Mechanical and Electrical Properties of Sn-3.5Ag Solder/Cu BGA Packages during Multiple Reflows
  Abstract

The mechanical and electrical properties of the Sn-3.5Ag solder/Cu BGA packages were investigated as a function of number of reflows. A continuous scallop-shaped Cu6Sn5 intermetallic compound (IMC) layer was formed at the solder/Cu interface upon 1 reflow process. After 3 reflows, very thin layer of Cu3Sn IMC was observed at the Cu6Sn5/Cu interface. As the number of reflows increased, the thickness of these IMCs increased with a cube root of reflow time. Shear force slightly increased up to 4 reflows and then gradually decreased with increasing the number of reflows. The maximum shear force was 11.7N when the thickness of the IMC layers was 3.7㎛. The fracture surfaces of all the specimens showed ductile failure characteristics up to 4 reflows, and then the fraction of the brittle IMC fracture increased with the number of reflows. The electrical resistance of the BGA packages increased with the number of reflows.

  Info
Periodical
Key Engineering Materials (Volumes 297-300)
Edited by
Young-Jin Kim, Dong-Ho Bae and Yun-Jae Kim
Pages
801-806
DOI
10.4028/www.scientific.net/KEM.297-300.801
Citation
J. M. Koo, Y. H. Lee, S. K. Kim, M. Y. Jeong, S. B. Jung, "Mechanical and Electrical Properties of Sn-3.5Ag Solder/Cu BGA Packages during Multiple Reflows", Key Engineering Materials, Vols. 297-300, pp. 801-806, 2005
Online since
November 2005
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