Paper Title:
A Comparative Study of The Fatigue Behavior of SnAgCu and SnPb Solder Joints
  Abstract

Fatigue behaviors of 63Sn37Pb and two types of lead-free solder joints were compared using pseudo-power cycling testing method, which provides more realistic load cycling to solder joints than chamber cycling method does. Pseudo-power cycling test was performed in various temperature ranges to evaluate the shear strain effect. A nonlinear finite element model was used to simulate the thermally induced visco-plastic deformation of solder joint in BGA packages. The results revealed that lead free solder joints have a good fatigue property in the low temperature condition, where a small strain was induced. In the high temperature condition where a large strain was induced, however, lead contained solder joints have a longer fatigue life.

  Info
Periodical
Key Engineering Materials (Volumes 297-300)
Edited by
Young-Jin Kim, Dong-Ho Bae and Yun-Jae Kim
Pages
831-836
DOI
10.4028/www.scientific.net/KEM.297-300.831
Citation
I. H. Kim, T. S. Park, S. Y. Yang, S. B. Lee, "A Comparative Study of The Fatigue Behavior of SnAgCu and SnPb Solder Joints ", Key Engineering Materials, Vols. 297-300, pp. 831-836, 2005
Online since
November 2005
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Price
$32.00
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