Paper Title:
Shear Strength of Fluxless Solder Joints between Sn and In Bumps
  Abstract

  Info
Periodical
Key Engineering Materials (Volumes 297-300)
Edited by
Young-Jin Kim, Dong-Ho Bae and Yun-Jae Kim
Pages
857-862
DOI
10.4028/www.scientific.net/KEM.297-300.857
Citation
S. H. Lee, Y. H. Kim, "Shear Strength of Fluxless Solder Joints between Sn and In Bumps ", Key Engineering Materials, Vols. 297-300, pp. 857-862, 2005
Online since
November 2005
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Price
$32.00
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