Paper Title:
Metal Leadframe Surface Cleaning Prior to Electroplating by Atmospheric Pressure Glow Discharge Plasma
  Abstract

Metal leadframes (Alloy 42) were cleaned using atmospheric pressure glow discharge plasma. Atmospheric pressure glow plasma was generated by a RF source of 13.56MHz with a matching network (300W power) on to the leadframes free from streamers and arc. Argon (Ar) and oxygen (O2) were used as the carrier gas and reactive gas, respectively. The addition of O2 gas to Ar decreased the contact angle of water and increased the surface cleaning rate due to the ncrease of oxygen radicals in the plasma. The chemical characteristics and morphologies of leadframe surface after the plama treatment were analyzed using X-ray photoelectron spectroscopy (XPS) and atomic force microscope (AFM), respectively. The contact angle of 82° before the plasma treatment was decreased to 5° in the processing condition with oxygen flow rate of 50sccm, treatment speed of 100mm/sec, and input power of 300W. These surface cleaning effect will be very useful in the replacement many steps of wet cleaning before electroplating.

  Info
Periodical
Key Engineering Materials (Volumes 297-300)
Edited by
Young-Jin Kim, Dong-Ho Bae and Yun-Jae Kim
Pages
869-874
DOI
10.4028/www.scientific.net/KEM.297-300.869
Citation
J. H. Cho, B. K. Kang, K. S. Kim, K. B. Jin, S. H. Kim, W. Y. Choi, "Metal Leadframe Surface Cleaning Prior to Electroplating by Atmospheric Pressure Glow Discharge Plasma ", Key Engineering Materials, Vols. 297-300, pp. 869-874, 2005
Online since
November 2005
Export
Price
$32.00
Share

In order to see related information, you need to Login.

In order to see related information, you need to Login.

Authors: Ying Chen, Zhi Jia Wang, Fu Jia Song, Yong Hua Xu
Abstract:In this paper, the application of glow discharge (low pressure) and dielectric barrier discharge (atmospheric) prior to pigment dyeing of...
96
Authors: Wen Yan Duan
Chapter 1: Materials Science and Engineering
Abstract:As-cast AM60 magnesium alloy was solid dissolved with exercising different pressures (atmospheric-pressure, 3, 4 and 5 Gpa) to it and...
315
Authors: Roslina Ismail, Fuaida Harun, Azman Jalar, Shahrum Abdullah
Chapter 1: Materials and Technologies for Soldering and Packaging in Electronics
Abstract:This work is a contribution towards the understanding of wire bond integrity and reliability in relation to their microstructural and...
79