Paper Title:
Reliability Characterization of Organic Solderability Preservatives (OSP) of IC Packages by Drop and Cyclic Bend Test
  Abstract

Cyclic bend test and drop test were carried out as a second level reliability test method in order to characterize the joint performance between electronic components and board. Two types of package substrates were used for the test. The one was NiAu plated, and the other one was organic solderability preservatives (OSP) finished. Drop test was done in accordance with JEDEC standard test method [1]. Drop impact and duration time was 1,500G and 0.5ms, respectively. Cyclic bend test was performed with Amkor internal specification because there is no international standard for the test. The Amkor internal specification was edited based on the IPC/JEDEC specification [2]. Board deflection and cyclic frequency was 3mm and 1Hz, respectively. NiAu substrate showed better mean life performance about by 30% in cyclic bend test. OSP substrate showed the same or better failure rate performance in drop test. Typical solder joint failures and intermetalic crack were found by failure analysis.

  Info
Periodical
Key Engineering Materials (Volumes 297-300)
Edited by
Young-Jin Kim, Dong-Ho Bae and Yun-Jae Kim
Pages
893-898
DOI
10.4028/www.scientific.net/KEM.297-300.893
Citation
S. M. Kim, E. S. Shon, Y. H. Ka, Y. J. Kim, J. Y. Kim, J. D. Kim, "Reliability Characterization of Organic Solderability Preservatives (OSP) of IC Packages by Drop and Cyclic Bend Test ", Key Engineering Materials, Vols. 297-300, pp. 893-898, 2005
Online since
November 2005
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Price
$32.00
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