Paper Title:
Vibration Reliability in Flip Chip Package
  Abstract

  Info
Periodical
Key Engineering Materials (Volumes 297-300)
Edited by
Young-Jin Kim, Dong-Ho Bae and Yun-Jae Kim
Pages
899-904
DOI
10.4028/www.scientific.net/KEM.297-300.899
Citation
M. K. Yeh, W.-X. Zhong, "Vibration Reliability in Flip Chip Package ", Key Engineering Materials, Vols. 297-300, pp. 899-904, 2005
Online since
November 2005
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Price
$32.00
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