Paper Title:
Tensile Stress-Strain Curves Modeling of Four Kinds of Solders with Temperature and Rate Dependence
  Abstract

A series of tensile tests at constant strain rate were conducted on tin-lead based solders with different Sn content under wide ranges of temperatures and strain rates. It was shown that the stress-strain relationships had strong temperature- and strain rate- dependence. The parameters of Anand model for four solders were determined. The four solders were 60Sn-40Pb, 40Sn-60Pb, 10Sn-90Pb and 5Sn-95Pb. Anand constitutive model was employed to simulate the stress-strain behaviors of the solders for the temperature range from 313K to 398K and the strain rate range from 0.001%sP -1 P to 2%sP -1 P. The results showed that Anand model can adequately predict the rate- and temperature- related constitutive behaviors at all test temperatures and strain rates.

  Info
Periodical
Key Engineering Materials (Volumes 297-300)
Edited by
Young-Jin Kim, Dong-Ho Bae and Yun-Jae Kim
Pages
905-911
DOI
10.4028/www.scientific.net/KEM.297-300.905
Citation
X. Chen, L. Zhang, M. Sakane, H. Nose, "Tensile Stress-Strain Curves Modeling of Four Kinds of Solders with Temperature and Rate Dependence ", Key Engineering Materials, Vols. 297-300, pp. 905-911, 2005
Online since
November 2005
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Price
$32.00
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