Paper Title
Authors: Woo Seong Che, Chang Gil Suk, Tae Gyu Park, Jun Tae Kim, Jun Hyub Park
Abstract:A new method to improve the wet etching characteristics is described. The anisotropic wet-etching of (100) Si with megasonic wave has been...
Authors: Hang Gao, Qing Lv, Li Gang Qu
Abstract:It is necessary to slot a groove on the outside of the bearing’s raceway in order to embed micro-sensor for smart bearing. Reasonable choice...
Authors: Takahiro Namazu, Shozo Inoue, Daisuke Ano, Keiji Koterazawa
Abstract:This paper focuses on investigating mechanical properties of micron-thick polycrystalline titanium nitride (TiN) films. We propose a new...
Authors: Y. Iino
Abstract:Effect of thickness on grain growth in Copper electrodeposits by cyclic stressing was studied by metallographic observation. The thickness of...
Authors: Min Seog Choi, Sung Hoon Choa
Abstract:We carry out reliablity tests and investigate the failure mechanisms for wafer level vacuum packaged (WLVP) MEMS resonator using an...
Authors: Jong Jin Kim, Dong Il Son, Dong Il Kwon
Abstract:Reliability is very important for the further development, commercialization and miniaturization of microelectromechanical systems (MEMS). In...
Authors: Hoon Cheol Park, Sang Ki Lee, Kwang Jin Kim
Abstract:In this work, flapping wings actuated by IPMCs are designed and simulated to mimick birds wing. In order for the wing to generate lift and...
Showing 91 to 100 of 468 Paper Titles