Paper Title:
Molecular Dynamics Analyze on Effects of Abrasive Size and Cut Depth on the Monocrystal Silicon Grinding
  Abstract

Molecular dynamics (MD) simulation is carried out to analyze the effects of abrasive ngrain size and cut depth on monocrystal silicon grinding process. Tersoff potential is used to describe the interactions of diamond and silicon atoms. Based on classical Newtonian mechanics law, the motion equations of atoms are established and the trajectory of each atom in phase space is obtained with the aid of Velocity Verlet algorithm. Debye model is introduced to convert between kinetic energy and temperature of an atom. The grinding processes of by single grain with different size and different cut depth are investigated in atomic space. Through comparing shearing force and potential energy in the single grain grinding process, the effects of cut depth and grain size on the grinding process are discussed. From the results of MD simulation, it is revealed that when the cut depth increases, both the shearing force in silicon crystal and potential energy between the silicon atoms rise, deformation and dislocations in the silicon lattices increase. As a result, all theses lead to^more severe surface and subsurface damage. With the decreasing of grain size in the same cut-depth nanometric grinding processes, the shearing force in silicon crystal and potential energy between the silicon atoms become larger, deformation and dislocations in the silicon lattices increase.

  Info
Periodical
Key Engineering Materials (Volumes 304-305)
Edited by
Guangqi Cai, Xipeng Xu and Renke Kang
Pages
286-289
DOI
10.4028/www.scientific.net/KEM.304-305.286
Citation
X. G. Guo, D. M. Guo, R. K. Kang, Z. J. Jin, "Molecular Dynamics Analyze on Effects of Abrasive Size and Cut Depth on the Monocrystal Silicon Grinding ", Key Engineering Materials, Vols. 304-305, pp. 286-289, 2006
Online since
February 2006
Export
Price
$32.00
Share

In order to see related information, you need to Login.

In order to see related information, you need to Login.

Authors: Hui Wu, Bin Lin, S.Y. Yu, Hong Tao Zhu
Abstract:Molecular dynamics (MD) simulation can play a significant role in addressing a number of machining problems at the atomic scale. This...
144
Authors: Zeng Qiang Li, Tao Sun, Yong Da Yan, Jun Jie Zhang, Ying Chun Liang, Shen Dong
Abstract:Molecular dynamics is a rapidly developing field of science and has become an established tool for studying the dynamic behavior of material...
249
Authors: Jia Chun Wang, Ji Min Zhang, Na Li, Yun Peng Kou
Abstract:In nanometric cutting process, the actual material removal can take place at atomic level, which makes it difficult or impossible to observe...
368
Authors: Ying Zhu, Zhi Xiang, Ling Ling Xie, Yin Cheng Zhang, Jian Cun Zhao
Chapter 2: Applied Mechanics, Design and Manufacturing, Mechanical Engineering, Automation and Control
Abstract:The current status of nanofabrication briefly reviewed, then molecular dynamics model of poly-silicon is founded on micro-nanoscale with...
369
Authors: Guo Kun Qu
Chapter 1: Research and Development of Technologies and Tools for Material Processing
Abstract:Molecular dynamics (MD) simulations of nanomachining of monocrystalline silicon were performed with the aid of Tersoff potential. The effects...
108