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Advances in Grinding and Abrasive Technology XIII

Key Engineering Materials Volumes 304 - 305

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• p218 Study on Fuzzy Reliability of Shaft Fixing Grinding Wheel in Internal Grinding   [ 181 K ]
  Authors: Chun Xiang Ma, Z.H. Qu, Q.J. Wu, Zhen Ruan, Li Ming Xu
• p222 Grindability Evaluation of Advanced Ceramics with AHP Approach   [ 165 K ]
  Authors: Ai Bing Yu, Y. Zhang
• p227 Application of Hilbert-Huang Transform to Predict Grinding Surface Quality On-Line   [ 292 K ]
  Authors: Jian Hua Wu, Zheng Qiang Yao, Y. Jin, H.B. Xie, Y.S. Zhao, L.Ch. Xu
• p232 Study on Critical Ductile Grinding Depth of Nano ZrO₂ Ceramics by the Aid of Ultrasonic Vibration   [ 520 K ]
  Authors: Dao Hui Xiang, Y.P. Ma, Bo Zhao, Ming Chen
• p236 Study on Grinding Waviness on Outer Race of Ball Bearing and Vibration Reducing Skills   [ 404 K ]
  Authors: X.D. Zhang, Yan Shen Xu, Xi Ling Zhang
• p241 Raman Microspectroscopy Study on the Ground Surface of Monocrystalline Silicon Wafers   [ 283 K ]
  Authors: Y.X. Zhang, Ren Ke Kang, Dong Ming Guo, Zhu Ji Jin
• p246 Model Establishment of Chip-Formation due to Shock under Ultra-High Speed Grinding   [ 177 K ]
  Authors: H.H. Zhao, Guang Qi Cai, X.J. Gao
• p251 Study on Single-Plane Biaxial Balance Monitor System in ULTRA-Precision Grinding   [ 359 K ]
  Authors: L. Zheng, Yin Biao Guo, Z.Z. Wang
• p256 Machinability Evaluation of Engineering Ceramics with Digraph Method   [ 165 K ]
  Authors: L.J. Zhong, Ai Bing Yu, S.Y. Yu, Hai Yan Du
• p261 Studies on the Grinding Characteristics of SiC Particle Reinforced Aluminum-Based MMCs   [ 729 K ]
  Authors: Fang Hong Sun, X.K. Li, Y. Wang, Ming Chen
• p266 Mechanism Analysis of Improving Grinding Quality with Machining Fluids of Oil Filmed Water Droplets   [ 325 K ]
  Authors: A.L. Wang, Y.Q. Wei, X.J. Zhu, Jan Yong Wang, Z.Z. Zheng, Xu Dong Sun, Z.Z. Liu
• p271 Prediction of Surface/Subsurface Crack Damage of Ground Ceramics   [ 161 K ]
  Authors: Bin Lin, Hong Tao Zhu, L. Han, S.Y. Yu
• p276 Microgrinding of Nanostructured Carbide Coatings: Ground Surface and Subsurface Damage Observations   [ 431 K ]
  Authors: Y.H. Ren, Zhi Xiong Zhou, Zhao Hui Deng
• p281 Thermal Model's Building and Experimental Research in Grinding Contact Zone for Plunge Grinding Process   [ 183 K ]
  Authors: X.M. Cheng, Long Shan Wang, Guang Fu Li
• p286 Molecular Dynamics Analyze on Effects of Abrasive Size and Cut Depth on the Monocrystal Silicon Grinding   [ 230 K ]
  Authors: X.G. Guo, Dong Ming Guo, Ren Ke Kang, Zhu Ji Jin