Paper Title:
Thermal Fatigue Life Prediction of ACF Bonding Flip Chip Packaging
  Abstract

The use of flip-chip technology has many advantages over other approaches for high-density electronic packaging. ACF (anisotropic conductive film) is one of the major flip-chip technologies, which has short chip-to-chip interconnection length, high productivity, and miniaturization of package. In this study, thermal fatigue life of ACF bonding flip-chip package has been predicted. Elastic and thermal properties of ACF were measured by using DMA and TMA. Temperature dependent nonlinear bi-thermal analysis was conducted and the result was compared with Moire interferometer result to verify FEM results. Calculated displacement field was well matched with experimental result. Thermal fatigue analysis was also conducted. The maximum shear strain occurs at the outmost located bump. Shear stress-strain curve was obtained to calculate fatigue life. Fatigue model for electronic adhesives was used to predict thermal fatigue life of ACF bonding flip-chip packaging. Approximately, 700 cycles have been expected under current conditions (JEDEC standard No. 22-A104)

  Info
Periodical
Key Engineering Materials (Volumes 306-308)
Edited by
Ichsan Setya Putra and Djoko Suharto
Pages
1049-1054
DOI
10.4028/www.scientific.net/KEM.306-308.1049
Citation
H. W. Nam, "Thermal Fatigue Life Prediction of ACF Bonding Flip Chip Packaging", Key Engineering Materials, Vols. 306-308, pp. 1049-1054, 2006
Online since
March 2006
Authors
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Price
$32.00
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