Paper Title:
Warpage Analysis of FBGA (Fine Ball Grid Array) Package by the Altered EMC (Epoxy Molding Compound) Filler Contents
  Abstract

In a semiconductor packaging process, the warpage greatly has influenced the reliability of the package as well as the workability. The strip warpage in FBGA package result from the structure of constitutes and the thermal mismatch by the mechanical or thermal properties such as CTE (Coefficient of Thermal Expansion) and Modulus of EMC, substrate, chip and adhesive materials. Therefore, the optimization of material properties and the package structure design has been needed by the numerical analysis. EMC used as one of the package constituents has a decisive effect on the trend of warpage, and the filler content is dominant in the EMC property. In this research, firstly the effect of the filler contents is evaluated in the warpage of FBGA package and the numerical analysis is performed with the high temperature – material properties to deal with the warpage under the actual measurement value.

  Info
Periodical
Key Engineering Materials (Volumes 306-308)
Edited by
Ichsan Setya Putra and Djoko Suharto
Pages
625-630
DOI
10.4028/www.scientific.net/KEM.306-308.625
Citation
Y. T. Park, Y. K. Whang, J. K. Hong, K. Y. Byeon, "Warpage Analysis of FBGA (Fine Ball Grid Array) Package by the Altered EMC (Epoxy Molding Compound) Filler Contents", Key Engineering Materials, Vols. 306-308, pp. 625-630, 2006
Online since
March 2006
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Price
$35.00
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