Paper Title
Page
Authors: S.P. Bao, Sie Chin Tjong
Abstract:High density polyethylene (HDPE)/organoclay nanocomposites toughened with maleated styrene-ethylene-butylene-styrene elastomer (SEBS-g-MA)...
187
Authors: Ryszard Pyrz
Abstract:A new atomic strain concept is formulated that allows calculation of continuum quantities directly within a discrete atomic (molecular)...
193
Authors: Saeed Saber-Samandari, Akbar Afaghi Khatibi
Abstract:The elastic modulus of interphase in polymer based nanocomposites is investigated. A new three-dimensional unit cell model has been developed...
199
Authors: V. Pettarin, Victor Jayme Roget Rodriguez Pita, Francisco Rolando Valenzuela-Díaz, S. Moschiar, L. Fasce, R. Seltzer, Marcos Lopes Dias, P. Frontini
Abstract:In this paper, we report the preparation of polyethylene composites with organically modified montmorillonite. Three different...
205
Authors: Shao Yun Fu, Qin-Yan Pan, Chuan Jun Huang, Guo Yang, Xin-Hou Liu, Lin Ye, Yiu Wing Mai
Abstract:Epoxy blend matrices were prepared by incorporating polyurethane-epoxy into diglycidyl ether of bisphenol-F (DGEBF) type epoxy while...
211
Authors: Kausala Mylvaganam, Liang Chi Zhang
Abstract:This paper discusses the methods of promoting covalent bonds between polymer and carbon nanotubes to make high performance composites. Such...
217
Authors: Xing Ping Zhou, Xiao Lin Xie, Fandi Zeng, Robert Kwok Yiu Li, Yiu Wing Mai
Abstract:Isotactic polypropylene (PP)/carbon nanotube (CNT) composites compatibilized by maleic anhydride grafted styrene-ethylene/butylenes-styrene...
223
Authors: Klaus Friedrich, Min Zhi Rong, Ming Qiu Zhang, Wen Hong Ruan
Abstract:Nano-sized silica particles were pre-grafted with poly(glycidyl methacrylate) (PGMA) by solution free-radical polymerization. When these...
229
Authors: Ke Wang, Pascal Ogier, Chauhari Wuiwui Tjiu, Chaobin He
Abstract:Alumina nano-crystals were dispersed in epoxy resin via different approaches. The effects of filler dispersion on the mechanical properties...
233
Authors: Xiao Ping Zhang, C.S.H. Lim, Yiu Wing Mai, Yao Wu Shi
Abstract:Thermal fatigue performance and creep resistance of soldered connections are crucial to the integrity and reliability of microelectronics,...
237
Showing 31 to 40 of 62 Paper Titles