Paper Title:

Mechanisms of Electrophoretic Deposition

Periodical Key Engineering Materials (Volume 314)
Main Theme Electrophoretic Deposition: Fundamentals and Applications II
Edited by A.R. Boccaccini, O. Van der Biest and R. Clasen
Pages 167-174
DOI 10.4028/www.scientific.net/KEM.314.167
Citation Jonathan J. Van Tassel et al., 2006, Key Engineering Materials, 314, 167
Online since July 2006
Authors Jonathan J. Van Tassel, Clive A. Randall
Keywords Electrophoretic Deposition (EPD), Particle Deposition Mechanisms, Particle Deposition Theory, Particulate Deposition
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There is no single mechanism of electrophoretic deposition (EPD). Just as there are several mechanisms for creating a stable colloidal suspension, there are several mechanisms by which particles can be destabilized to form an adherent deposit at an electrode surface. The goal of this paper is to provide a listing of the mechanisms by which electrophoretic deposition can occur. Several of these mechanisms have already been demonstrated, while others remain speculative. The first step in this process is to provide a clear definition of what exactly EPD is, and, equally important, to clearly distinguish EPD from three other very similar processes: electrostatic coating, electrodeposition, and electrocasting. From this definition a series of logical steps leads to a list of mechanisms by which a stable colloid can be converted to a stable particle compact.