Paper Title:
Experimental Study on Ultrasonic Grinding and Polishing for Large-Scale Silicon Wafer
  Abstract

How to improve the surface quality of large-scale silicon wafer in the ultra-precision grinding process, will always be the most important issue discussed by the silicon wafer manufacturer. In this paper, the advantage of ultrasonic grinding is being explored. These advantages included small macro grinding force, grinding stress, low grinding heat, which will reduce the surface damage. Combined with relatively abrasive, a large-scale silicon wafer can be processed. Through the study, an experimental system for ultrasonic grinding of large-scale silicon wafer is designed. The working parameter is optimized and the expected result is obtained, which searches a new way for the practical implementation.

  Info
Periodical
Key Engineering Materials (Volumes 315-316)
Edited by
Zhejun Yuan, Xipeng Xu, Dunwen Zuo, Julong Yuan and Yingxue Yao
Pages
6-9
DOI
10.4028/www.scientific.net/KEM.315-316.6
Citation
W. Bleck, M. Wang, D. W. Zuo, M. Wang, Y. N. Rui, "Experimental Study on Ultrasonic Grinding and Polishing for Large-Scale Silicon Wafer", Key Engineering Materials, Vols. 315-316, pp. 6-9, 2006
Online since
July 2006
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Price
$32.00
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