Experimental Study on Ultrasonic Grinding and Polishing for Large-Scale Silicon Wafer |
| Journal |
Key Engineering Materials (Volumes 315 - 316) |
| Volume |
Advances in Machining & Manufacturing Technology VIII |
| Edited by |
Zhejun Yuan, Xipeng Xu, Dunwen Zuo, Julong Yuan and Yingxue Yao |
| Pages |
6-9 |
| DOI |
10.4028/www.scientific.net/KEM.315-316.6 |
| Online since |
July, 2006 |
| Authors |
Wolfgang Bleck,
Ming Wang,
Dun Wen Zuo,
Min Wang,
Yan Nian Rui
|
| Keywords |
Experimental Study, Large-Scale Silicon Wafer, Ultrasonic Grinding |
| Abstract |
How to improve the surface quality of large-scale silicon wafer in the ultra-precision
grinding process, will always be the most important issue discussed by the silicon wafer
manufacturer. In this paper, the advantage of ultrasonic grinding is being explored. These
advantages included small macro grinding force, grinding stress, low grinding heat, which will
reduce the surface damage. Combined with relatively abrasive, a large-scale silicon wafer can be
processed. Through the study, an experimental system for ultrasonic grinding of large-scale silicon
wafer is designed. The working parameter is optimized and the expected result is obtained, which
searches a new way for the practical implementation. |
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