Low Temperature Sintering of Alumina by CuO-TiO2-Nb2O5 Additives |
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| Journal | Key Engineering Materials (Volume 320) |
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| Volume | Electroceramics in Japan IX |
| Edited by | Keiichi Katayama, Kazumi Kato, Tadashi Takenaka, Masasuke Takata and Kazuo Shinozaki |
| Pages | 181-184 |
| DOI | 10.4028/www.scientific.net/KEM.320.181 |
| Citation | Koichi Shigeno et al., 2006, Key Engineering Materials, 320, 181 |
| Online since | September, 2006 |
| Authors | Koichi Shigeno, Hidenori Katsumura, Hiroshi Kagata, Hiroshi Asano, Osamu Inoue |
| Keywords | Aluminium, Bend Strength, Dielectric Properties, LTCC, Sintering Additive, Thermal Conductivity (TC) |
| Abstract | We examined sintering additives for alumina. When using CuO-TiO2-Nb2O5 additive, dense sintered alumina was obtained by firing at 1000°C or below, even though additive content was at most 10 mass%. It is considered that the formation of mixed oxide consists of CuO, TiO2 and Nb2O5 has an important role for low temperature sintering of alumina. Thermal conductivity of the above sample was 15 W/mK, which was the highest value yet reported within LTCC (Low Temperature Co-fired Ceramics) materials. |
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