Paper Title:
Out-of-Plane Micro-ESPI System for Measurement of Mechanical Properties of Film Materials
  Abstract

To measure the micro-mechanical properties for micro/nano materials, out-of-plane ESPI system and micro-strip bend testing system were developed. For the bending system, PZT actuator was controlled with the stroke resolution of 0.6 nm and out-of-plane ESPI system was developed in compact and portable type. To quantitatively analyze the out-of-plane ESPI fringe patterns, 4-bucket technique was used and unwrapped phase map was obtained. Electrolytic copper foil with the thickness of 18 μm was used for preparation of the strip bend specimen with length of 8 mm and three different widths of 2, 3 and 5 mm. The strip bending tests showed that the out-of-plane deflection in the bend specimen was measured with a maximum of 8 % in error. Furthermore, from the experiment, the variation of the deflection along the supporting span could be determined and significant region was linear.

  Info
Periodical
Key Engineering Materials (Volumes 321-323)
Edited by
Seung-Seok Lee, Joon Hyun Lee, Ik Keun Park, Sung-Jin Song, Man Yong Choi
Pages
116-120
DOI
10.4028/www.scientific.net/KEM.321-323.116
Citation
D. I. Kim, Y. H. Huh, C. D. Kee, "Out-of-Plane Micro-ESPI System for Measurement of Mechanical Properties of Film Materials", Key Engineering Materials, Vols. 321-323, pp. 116-120, 2006
Online since
October 2006
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Price
$32.00
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