Paper Title:
Interfacial Reaction of Cu-Tie Coating-Polyimide Flexible Copper Clad Laminates
  Abstract

Adhesion of flexible copper clad laminates (FCCL) on two different types of polyimide (PI), sputtering raw polyimide (SRPI) and casting raw polyimide (CRPI), were studied. Chromium (Cr), strongly reacts with dangling O bonds, was used as tie-coating layer in order to improve low adhesion between copper (Cu) and polyimide (PI). Polyimide surfaces were pretreated with gas plasma that was generated with a mixture of argon and oxygen before sputtering process. Adhesion measurement was performed on these samples according to IPC specification. The results show that the peel strength of the FCCL on SRPI was higher than on CRPI. This is considered to be due to the formation of Cu-Cr-O solid solution at the metal- PI interface.

  Info
Periodical
Key Engineering Materials (Volumes 321-323)
Edited by
Seung-Seok Lee, Joon Hyun Lee, Ik Keun Park, Sung-Jin Song, Man Yong Choi
Pages
1675-1678
DOI
10.4028/www.scientific.net/KEM.321-323.1675
Citation
J. W. Lee, I. S. Lee, T. W. Kang, D. W. Kim, S. H. Kim, "Interfacial Reaction of Cu-Tie Coating-Polyimide Flexible Copper Clad Laminates", Key Engineering Materials, Vols. 321-323, pp. 1675-1678, 2006
Online since
October 2006
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Price
$32.00
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