Paper Title:
Reliability of Flip Chip Package with Underfills under Thermal Shock
  Abstract

The thermal fatigue properties of the solder joints with various underfills were evaluated by thermal shock test. Flip chip package with electroless nickel-immersion gold plated on Cu pad of FR-4 substrate and the Sn-37Pb solder ball was used. The thermal fatigue crack initiated at the edges of interface between solder and silicon die. The fatigue property of package with underfill, which has a higher glass transition temperature (Tg) and lower coefficient of thermal expansion (CTE) value was better than that of package with underfill having a lower Tg and higher CTE.

  Info
Periodical
Key Engineering Materials (Volumes 321-323)
Edited by
Seung-Seok Lee, Joon Hyun Lee, Ik Keun Park, Sung-Jin Song, Man Yong Choi
Pages
1719-1722
DOI
10.4028/www.scientific.net/KEM.321-323.1719
Citation
B. I. Noh, S. B. Jung, "Reliability of Flip Chip Package with Underfills under Thermal Shock", Key Engineering Materials, Vols. 321-323, pp. 1719-1722, 2006
Online since
October 2006
Export
Price
$32.00
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