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Advanced Nondestructive Evaluation I

Key Engineering Materials Volumes 321 - 323

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• p1675 Interfacial Reaction of Cu-Tie Coating-Polyimide Flexible Copper Clad Laminates   [ 195 K ]
  Authors: Jea Won Lee, In Seon Lee, Tae Won Kang, Dong Won Kim, Sang Ho Kim
• p1679 Evaluation of Shockproofness of Small Form Factor Mobile TFT-LCD   [ 918 K ]
  Authors: Byung Sun Kim, Dock Jin Lee, Ja Choon Koo, Jae Boong Choi, Young Jin Kim, Jong Nam Lee, Young Bee Chu
• p1683 Preparation and Characterization of Nanosized Al₂O₃ Particles Synthesized by the thermal MOCVD and Plasma CVD   [ 279 K ]
  Authors: Hee Joon Kim, Se Woong Oh, Hiroyuki Noda, Ho Jung Chang, Lae Hyun Kim
• p1687 Growth of Highly Oriented Zinc Oxide Thin Films by Plasma Enhanced Chemical Vapor Deposition   [ 157 K ]
  Authors: Hee Joon Kim, Dong Young Jang, Prem Kumar Shishodia, Akira Yoshida
• p1691 Optical Emission Spectra Related to Microstructures of Diamond Film Deposited by Plasma Enhanced Chemical Vapor Deposition   [ 600 K ]
  Authors: Mikio Noda, Masayoshi Umeno, Hee Joon Kim
• p1695 Thermal Diffusivity and Phase Transition of Rare Earth Manganites   [ 246 K ]
  Authors: Migaku Kobayashi, Hirohisa Sato, Yoshihiko Hiyoshi, Naoki Kamegashira, Doh Jae Lee, Hee Joon Kim
• p1699 Preparation and Characterization of Polymer Light Emitting Diodes with ITO/PEDOT:PSS/MEH-PPV/LiF/Al Structure   [ 332 K ]
  Authors: Jae Hyouk Yoo, Ho Jung Chang, Su Cheol Gong, In Jae Baek, Hyun Seong Lim, Gee Keun Chang, Young Chol Chang, Hee Joon Kim
• p1704 (110) Silicon Hard Master Fabrication Using Wet Etching for Multi-Mode Planar Optical Splitter   [ 366 K ]
  Authors: Yu Min Jung, Yeong Cheul Kim, Hwa Il Seo
• p1707 Development of In-Situ SUB-100nm Particle Detection in Vacuum System   [ 367 K ]
  Authors: Kang Ho Ahn, Yong Min Kim
• p1711 Ultrasonic Measurement of Elastic Properties of Nanostructured Alumina   [ 171 K ]
  Authors: Noh Yu Kim, Hee Joon Kim, Se Woong Oh, N. Hozumi, Cheol Kyou Lee, Min Sung Hong
• p1715 A Study on the Measurement System Using an Ultrasonic Sensor in Electron Beam Welding   [ 395 K ]
  Authors: Min Sung Hong, Jong Min Kim, Noh Yu Kim
• p1719 Reliability of Flip Chip Package with Underfills under Thermal Shock   [ 862 K ]
  Authors: Bo In Noh, Seung Boo Jung
• p1723 The Evaluation of Weldability for AZ31B-H24 and AZ91C-F Mg Alloys in Friction Stir Welding   [ 973 K ]
  Authors: Woong Seong Chang, Heung Ju Kim, Joong Suk Noh, Han Sur Bang
• p1729 Study on Evaluation of AE Signals at Weld Region of SA 516 Steel   [ 209 K ]
  Authors: Na Eui Gyun, Kim Hoon, Kanji Ono
• p1733 The Study on Mechanical Properties in Narrow-Gap Welds for SA312 TP347   [ 7 M ]
  Authors: Seung Wan Woo, Choon Yeol Lee, Jae Do Kwon, Young Hwan Choi, Ho Sang Shin