Paper Title:
Thermo-Mechanical Behavior of MEMS Gyroscope Sensor Package Subjected to Temperature Change
  Abstract

In this paper, deformation behavior of the MEMS gyroscope package subjected to temperature change is investigated using a high-sensitivity moiré interferometry. Temperature dependent analyses of warpage and extension/contraction of the package are presented. Detailed global and local deformations of the package by temperature change are investigated and its effect on the frequency shift of the MEMS gyroscope is studied.

  Info
Periodical
Key Engineering Materials (Volumes 324-325)
Edited by
M.H. Aliabadi, Qingfen Li, Li Li and F.-G. Buchholz
Pages
227-230
DOI
10.4028/www.scientific.net/KEM.324-325.227
Citation
J. W. Joo, Y. C. Cho, J. H. Won, S. H. Choa, "Thermo-Mechanical Behavior of MEMS Gyroscope Sensor Package Subjected to Temperature Change", Key Engineering Materials, Vols. 324-325, pp. 227-230, 2006
Online since
November 2006
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$32.00
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