Paper Title:
Experimental Studies of Through-Wafer Copper Interconnect in Wafer Level MEMS Packaging
  Abstract

In this paper, mechanical reliability issues of copper through-wafer interconnection are investigated numerically and experimentally. Several factors which could induce via hole cracking failure are investigated such as thermal expansion mismatch, via etch profile, copper diffusion phenomenon, and cleaning process. Improvement methods are also suggested.

  Info
Periodical
Key Engineering Materials (Volumes 324-325)
Edited by
M.H. Aliabadi, Qingfen Li, Li Li and F.-G. Buchholz
Pages
231-234
DOI
10.4028/www.scientific.net/KEM.324-325.231
Citation
S. H. Choa, "Experimental Studies of Through-Wafer Copper Interconnect in Wafer Level MEMS Packaging", Key Engineering Materials, Vols. 324-325, pp. 231-234, 2006
Online since
November 2006
Authors
Export
Price
$32.00
Share

In order to see related information, you need to Login.

In order to see related information, you need to Login.

Authors: Dong Young Sung, In Soo Kim, Min Gu Lee, No Jin Park, Bee Lyong Yang, Jun Mo Yang, Jung Kyu Ko
Abstract:TiN thin films are widely used as a coating material due to their good mechanical and conductivity properties, high thermal properties,...
1371
Authors: Kuen Ming Shu, Hung Rung Shih
Abstract:There are several types of welding method to join metal and ceramic. This paper gives a description of an experimental study of the...
841
Authors: Seong Min Lee
Abstract:Semiconductor devices are usually formed on a single silicon wafer during a batch processing method. Individual devices are separated from...
485
Authors: Jin Tang Shang, Jun Wen Liu, Di Zhang, Bo Yin Chen, Chao Xu, Xin Hu Luo, Hui Yu, Jing Dong Liu, Qin Gan Huang, Jie Ying Tang, Ming Qin
Abstract:Many MEMS devices including accelerometer and gyroscopes, having moving parts, requires hermetic and low cost packaging. In this paper we...
23
Authors: Yu Xin Li, De Yong Chen, Jun Bo Wang
Chapter 1: Micro/Nano Transducer/Acutar/Robot
Abstract:This paper presents a method of low temperature wafer level adhesive bonding using non-photosensitive bisbenzocyclobutene (BCB) from Dow Co...
55