Dynamic Anti-Plane Behavior of the Interaction Between a Crack and a Circular Cavity in a Piezoelectric Medium |
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| Journal | Key Engineering Materials (Volumes 324 - 325) |
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| Volume | Fracture and Damage Mechanics V |
| Edited by | M.H. Aliabadi, Qingfen Li, Li Li and F.-G. Buchholz |
| Pages | 29-32 |
| DOI | 10.4028/www.scientific.net/KEM.324-325.29 |
| Citation | Tian Shu Song et al., 2006, Key Engineering Materials, 324-325, 29 |
| Online since | November, 2006 |
| Authors | Tian Shu Song, Hong Liang Li, Jung Qiang Dong |
| Keywords | Dynamic Stress Concentration Factor (DSCF), Dynamic Stress Intensity Factor (DSIF), GREEN’s Function, Interacting Crack and Cavity, Piezoelectric Medium |
| Abstract | In this paper, the dynamic interaction is investigated theoretically between a crack and a circular cavity in an infinite piezoelectric medium under time-harmonic incident anti-plane shearing. The formulations are based on the method of complex variable and Green’s function. The resulting dynamic stress intensity factors at the crack’s tip and dynamic stress concentration factors at the cavity’s edge are obtained with crack-division technique. Numerical results are plotted to show how the frequencies of incident wave, the piezoelectric characteristic parameters of the material and the geometry of the crack and the circular cavity influence upon the dynamic stress intensity factors and dynamic stress concentration factors. |
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