Paper Title:
Failure Modes and FEM Analysis of Microelectronic Packaging
  Abstract

Based on the theory of thermo-elasticity mechanics, the finite element numerical simulation models have been established for the package bulging process. The mechanism of the interfacial void evolution is postulated. By taking the interface strength as function of process (moisture and temperature), it shows that the critical stress that results in the unstable void growth and delamination at the interface is significantly reduced and becomes comparable to the magnitude of the vapor pressure. The simulation result can make us understand the mechanism of the void-growth at the interface framework and provide data base for improving reliability of package and optimum design

  Info
Periodical
Key Engineering Materials (Volumes 324-325)
Edited by
M.H. Aliabadi, Qingfen Li, Li Li and F.-G. Buchholz
Pages
455-458
DOI
10.4028/www.scientific.net/KEM.324-325.455
Citation
G. Y. Lu, D. Y. Hu, "Failure Modes and FEM Analysis of Microelectronic Packaging ", Key Engineering Materials, Vols. 324-325, pp. 455-458, 2006
Online since
November 2006
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Price
$32.00
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