Paper Title:
Numerical Calculation of Peeling Strength in Anisotropic Conducive Adhesive Bonding
  Abstract

The cohesive zone interface model was used to calculate 90o peel in the ACF bonding samples. The constitutive equation for the interface model was modified by introduction a damage factor χ . The thermal damage factor and humidity damage factor can be derived from the experiment data. The interfacial model with damage factor can change the maximal peel stress and the delamination length. The calculation result of the interfacial model with damage factor agreed well to the experiment of the 90o peeling.

  Info
Periodical
Key Engineering Materials (Volumes 324-325)
Edited by
M.H. Aliabadi, Qingfen Li, Li Li and F.-G. Buchholz
Pages
471-474
DOI
10.4028/www.scientific.net/KEM.324-325.471
Citation
J. Zhang, X. Chen, X. L. Wei, "Numerical Calculation of Peeling Strength in Anisotropic Conducive Adhesive Bonding ", Key Engineering Materials, Vols. 324-325, pp. 471-474, 2006
Online since
November 2006
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Price
$32.00
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