Paper Title:
Passivation Cracking Analyses of Micro-Structures of IC Packages
  Abstract

The passivation cracking of Micro-structures of IC packages is studied by maximum principal stress theory using a certain 2D FEM model with different design parameters, pitch of lines, width of line, thickness of epoxy, thickness of dielectric layer, thickness of glue, the glue material’s yielding stress and Aluminium yielding stress (following as “d”, “w”, “t_epo”, “t_Teos”, “t_glue” “sy_glue” and “sy_al” respectively). For different critical process steps, the final process temperature is acted as a representative parameter to analyze its impact. Furthermore, Response Surface Model (RSM) of principal stress is established using any two design parameters. Results show that “d”, “w”, “t_epo”, “sy_glue” and “sy_al” will have great influence on passivation cracking while “t_Teos” have a little impact.

  Info
Periodical
Key Engineering Materials (Volumes 324-325)
Edited by
M.H. Aliabadi, Qingfen Li, Li Li and F.-G. Buchholz
Pages
515-518
DOI
10.4028/www.scientific.net/KEM.324-325.515
Citation
Y. T. He, H. P. Li, R. Shi, F. Li, G.Q. Zhang, L.J. Ernst, "Passivation Cracking Analyses of Micro-Structures of IC Packages", Key Engineering Materials, Vols. 324-325, pp. 515-518, 2006
Online since
November 2006
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$32.00
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