Paper Title:
Plastic Dissipation and Temperature Field around a Steady Running Crack
  Abstract

Temperature field is formed due to heat dissipation when material is subjected to irreversible deformation. In this paper, the heat dissipation in the crack-tip plastic zone was considered. By considering the propagating crack-tip plastic zone as a running heat source and constructing a reasonable heat source density distribution function, the temperature field around a steady running crack was obtained. It is shown that temperature rise is dependent on the crack growth speed and the material parameters. The maximum temperature rise reaches to >50 oC in our example calculations for a steady running crack in PMMA.

  Info
Periodical
Key Engineering Materials (Volumes 324-325)
Edited by
M.H. Aliabadi, Qingfen Li, Li Li and F.-G. Buchholz
Pages
895-898
DOI
10.4028/www.scientific.net/KEM.324-325.895
Citation
W. B. Luo, T. Q. Yang, "Plastic Dissipation and Temperature Field around a Steady Running Crack", Key Engineering Materials, Vols. 324-325, pp. 895-898, 2006
Online since
November 2006
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Price
$32.00
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