Plastic Dissipation and Temperature Field around a Steady Running Crack |
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| Journal | Key Engineering Materials (Volumes 324 - 325) |
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| Volume | Fracture and Damage Mechanics V |
| Edited by | M.H. Aliabadi, Qingfen Li, Li Li and F.-G. Buchholz |
| Pages | 895-898 |
| DOI | 10.4028/www.scientific.net/KEM.324-325.895 |
| Citation | Wen Bo Luo et al., 2006, Key Engineering Materials, 324-325, 895 |
| Online since | November, 2006 |
| Authors | Wen Bo Luo, Ting Qing Yang |
| Keywords | Crack Growth, Crack Tip Plastic Zone, Heat Dissipation, Temperature Field |
| Abstract | Temperature field is formed due to heat dissipation when material is subjected to irreversible deformation. In this paper, the heat dissipation in the crack-tip plastic zone was considered. By considering the propagating crack-tip plastic zone as a running heat source and constructing a reasonable heat source density distribution function, the temperature field around a steady running crack was obtained. It is shown that temperature rise is dependent on the crack growth speed and the material parameters. The maximum temperature rise reaches to >50 oC in our example calculations for a steady running crack in PMMA. |
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