Paper Title:
An Evaluation of Low-Cycle Fatigue Property for Sn-3.5Ag and Sn-0.7Cu Lead-Free Solders Using Surface Deformation
  Abstract

The low-cycle fatigue behavior and the relationship between the surface features in the low-cycle fatigue testing and the fatigue life of Sn-3.5Ag and Sn-0.7Cu lead-free solders were investigated at strain rate of 0.1%/s at room temperature, 80 and 120oC. In addition, the fatigue life was estimated by using the surface deformation of the solders, and image processing. And also, it was compared with Coffin-Manson type of fatigue behavior. The fatigue life of Sn-3.5Ag solder was superior to that of Sn-0.7Cu solder at temperatures, 80 and 120oC. The fatigue life determined by surface deformation indicated a close behavior to Coffin-Manson type fatigue behavior in those solders. Therefore the low-cycle fatigue life of solders could be estimated by the surface deformation.

  Info
Periodical
Key Engineering Materials (Volumes 326-328)
Edited by
Soon-Bok Lee and Yun-Jae Kim
Pages
1035-1038
DOI
10.4028/www.scientific.net/KEM.326-328.1035
Citation
T. Takahashi, S. Hioki, I. Shohji, O. Kamiya, "An Evaluation of Low-Cycle Fatigue Property for Sn-3.5Ag and Sn-0.7Cu Lead-Free Solders Using Surface Deformation", Key Engineering Materials, Vols. 326-328, pp. 1035-1038, 2006
Online since
December 2006
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$32.00
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