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Development of System for Simultaneous Measurement of Stress and Temperature

Journal Key Engineering Materials (Volumes 326 - 328)
Volume Experimental Mechanics in Nano and Biotechnology
Edited by Soon-Bok Lee and Yun-Jae Kim
Pages 163-166
DOI 10.4028/www.scientific.net/KEM.326-328.163
Citation Eisaku Umezaki et al., 2006, Key Engineering Materials, 326-328, 163
Online since December, 2006
Authors Eisaku Umezaki, Masahito Abe
Keywords Photoelasticity, Simultaneous Measurement, Stress, Temperature, Thermography, Ultraviolet Curing Resin, Ultraviolet Ray
Abstract

A system was developed for simultaneously measuring stress and temperature in structures in time series. The stress and temperature were measured using the photoelastic technique in the form of phase stepping and the thermographic technique, respectively. Four phase-stepped photoelastic images were captured simultaneously using beam-splitting optics. A beam splitter was used for transmitting light in the visible range while simultaneously reflecting light in the infrared range. The system was applied to ultraviolet curing resin with a step part illuminated with ultraviolet rays, and the stress and temperature in the curing process were measured. Results showed that the stress and temperature in the curing process can be measured simultaneously in time series using the system. The step part of the resin affected the distribution of the stress and temperature

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