Paper Title:
Interfacial Residual Stress Measurement of SiC/Epoxy Composites by Microphotoelastic Method
  Abstract

Interfacial residual stresses play an important role in the mechanical properties. In this paper, the interfacial residual stresses of SCI/Epoxy composites were determined using a novel technique-microphotoelastic method. The thermal residual stress field was also numerically simulated using a finite element software MSC.MARC. The difference and the similarities between the experimental results and the simulation of FEM analysis were discussed and the availability of the method was preliminarily certified.

  Info
Periodical
Key Engineering Materials (Volumes 326-328)
Edited by
Soon-Bok Lee and Yun-Jae Kim
Pages
273-276
DOI
10.4028/www.scientific.net/KEM.326-328.273
Citation
X. W. Yang, X. H. Ji, Y. M. Xing, Y. W. Qin, "Interfacial Residual Stress Measurement of SiC/Epoxy Composites by Microphotoelastic Method", Key Engineering Materials, Vols. 326-328, pp. 273-276, 2006
Online since
December 2006
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$32.00
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