Paper Title:
Effect of High Glass Transition Temperature on Reliability of Non-Conductive Film (NCF)
  Abstract

Among many factors that influence the reliability of a flip-chip assembly using NCF interconnections, the most effective parameters are often the coefficient of thermal expansion (CTE), the modulus (E), and the glass transition temperatures (Tg). Of these factors, the effect of Tg on thermal deformation and device reliability is significant; however, it has not been shown clearly what effect Tg has on the reliability of NCF. The Tg of a conventional NCF material is approximately 110°C. In this study, a new high Tg NCF material that has a 140oC Tg is proposed. The thermal behaviors of the conventional and new NCFs between -40oC to 150oC are observed using an optical method. Twyman-Green interferometry and the moiré interferometry method are used to measure the thermal micro-deformations. The Twyman-Green interferometry measurement technique is applied to verify the stress-free state. The stress-free temperatures of the conventional and new Tg NCF materials are approximately 100oC and 120oC respectively. A shear strain at a part of the NCF chip edge is measured by moiré interferometry. Additionally, a method to accurately measure the residual warpage and shear strain at room temperature is proposed. Through the analysis of the relationship between the warpage and the shear strain, the effect of the high-Tg NCF material on the reliability is studied.

  Info
Periodical
Key Engineering Materials (Volumes 326-328)
Edited by
Soon-Bok Lee and Yun-Jae Kim
Pages
517-520
DOI
10.4028/www.scientific.net/KEM.326-328.517
Citation
J. H. Park, C. K. Chung, K. W. Paik, S. B. Lee, "Effect of High Glass Transition Temperature on Reliability of Non-Conductive Film (NCF)", Key Engineering Materials, Vols. 326-328, pp. 517-520, 2006
Online since
December 2006
Export
Price
$32.00
Share

In order to see related information, you need to Login.

In order to see related information, you need to Login.

Authors: Michihiro Takiguchi, Fusahito Yoshida
Abstract:The adhesive fatigue strength was investigated by performing repeated tensile lap shear experiments of an aluminum single-lap joint bonded...
1479
Authors: Jeong Pyo Nam, Sung Ho Yoon, Young Eun Hwang, Hong Li, Qing Fen Li
Abstract: In this study, the effect of combined environmental factors such as ultraviolet ray, high temperature and high moisture on mechanical ...
33
Authors: Xiao Chun Ma, Ji Hui Yin
Abstract:The thermal effect has pronounced influence on deformation behavior of materials at nanoscale due to small length scale. In current paper,...
155
Authors: Gyun Lee, Hyo Sun Yu, Sung Mo Yang, Hee Yong Kang, Dong Pyo Hong, Joon Hyuk Song
Chapter 07: Applied Chemistry
Abstract:The use of Pb-free solder alloys are just newly developed materials and their properties are not well established and documented yet. So, the...
694
Authors: Ji Ung Choi, Woo Hyun Cho, Jong Hoon Yoon, Joon Tae Yoo, Ho Sung Lee
Chapter 3: Advanced Materials Science and Engineering
Abstract:It is well known that alloy 718 shows excellent mechanical strength and corrosion resistance and this alloy is now successfully utilized for...
900