Paper Title:
Effects of Packaging Induced Stress on MEMS Devices and Its Improvements
  Abstract

In MEMS, packaging induced stress or stress induced structure deformation becomes increasing concerns since it directly affects the performance of the device. The conventional MEMS SOI (silicon-on-insulator) gyroscope, packaged using the anodic bonding at the wafer level and EMC (epoxy molding compound) molding, has a deformation of MEMS structure caused by thermal expansion mismatch. Therefore we propose a packaged SiOG (Silicon On Glass) process technology and more robust spring design.

  Info
Periodical
Key Engineering Materials (Volumes 326-328)
Edited by
Soon-Bok Lee and Yun-Jae Kim
Pages
529-532
DOI
10.4028/www.scientific.net/KEM.326-328.529
Citation
S. H. Choa, M. C. Lee, Y. C. Cho, "Effects of Packaging Induced Stress on MEMS Devices and Its Improvements", Key Engineering Materials, Vols. 326-328, pp. 529-532, 2006
Online since
December 2006
Export
Price
$32.00
Share

In order to see related information, you need to Login.

In order to see related information, you need to Login.

Authors: Kyu Shik Shin, Joon Shik Park, Kwang Bum Park, Hyo Derk Park, Jeong Rim Kim, Min Chan Kim
Abstract:Design and fabrication of micro mixing cells and detection cells were investigated. Glass micro mixing cells with island structures among...
1849
Authors: Cui Rong Liu, Tuo Sheng Jia, Qing Sen Meng
Abstract:In this paper the technological experiments of static bonding has been carried out in the bonding of multi-layer Pyrex7740 Glass and Al. The...
361
Authors: Yue Hu, Hao Wang, De Wen Wang, Cai Xia Du, Miao Miao Ma, Jin Yang, Jin He
Chapter 7: Nanomaterials, Microelectronic Materials and New Functional Materials
Abstract:A 600V-class lateral double-diffused metal-oxide-semiconductor (LDMOS) field-effect transistor with step-doped drift region (SDD) in partial...
514
Authors: Zhi Hua Chen, Le Le Liu, Ding Bang Xiao, Hong Juan Cui, Xing Hua Wang
Chapter 3: Measurements, Sensors and MEMS
Abstract:Silicon micro-fabricated gyroscope are very sensitive to ambient temperature, this paper conducted a novel active temperature controlling...
600