Paper Title:
An Experimental Study of the Polishing Process for MgO Single Crystal Substrate
  Abstract

In order to obtain ultra-smooth and damage free substrate surfaces for MgO single-crystal substrate with high polishing efficiency, an experimental investigation based on systemically designed polishing experiments are presented and discussed. Considering the structural characteristics and chemical properties of the MgO single crystal, the experiments use a polishing slurry containing SiO2 abrasives so that the process is performed under a combination of mechanical and chemical actions. The effects of the polishing process parameters, such as polishing pressure, rotational speed of polishing plate, and the flow rate and concentration of the polishing slurry, on the surface roughness and material removal rate (MRR) are analyzed. Finally, a recommendation is made for selecting the appropriate polishing parameters for MgO single crystal substrate, based on which a surface roughness of 0.3nm can be achieved on the MgO substrate in 20min of polishing time.

  Info
Periodical
Edited by
Dongming Guo, Tsunemoto Kuriyagawa, Jun Wang and Jun’ichi Tamaki
Pages
225-230
DOI
10.4028/www.scientific.net/KEM.329.225
Citation
K. Wang, R. K. Kang, Z. J. Jin, N. H. Wang, "An Experimental Study of the Polishing Process for MgO Single Crystal Substrate", Key Engineering Materials, Vol. 329, pp. 225-230, 2007
Online since
January 2007
Export
Price
$32.00
Share

In order to see related information, you need to Login.

In order to see related information, you need to Login.

Authors: Hong Ho Cheng, C.C. Chen
Abstract:Diamond has been well recognized a strategic engineering material. It possesses excellent physical and chemical properties including the...
1225
Authors: Xue Feng Xu, H.F. Chen, H.T. Ma, B.X. Ma, Wei Peng
Abstract:In order to increase the material removal rate of silicon wafer, composite abrasives slurry was used in CMP. Zeta potential of polymer...
231
Authors: J.X. Su, Jia Xi Du, X.L. Liu, H.N. Liu, R.K. Kang
Abstract:Chemical mechanical polishing (CMP) has become the most widely used planarization technology in the metal and hard-brittle crystal substrate...
243
Authors: Bo Liu, Xi Tu, Xu Zhong Zhang, Jun An Zhang
Chapter 2: Precision & Ultra-Precision Machining
Abstract:A lapping and polishing technology of flotation cushion was studied and some improved equipments were carried out to polish flotation cushion...
140
Authors: Jian Xiu Su, Jia Xi Du, Xing Long Liu, Hai Na Liu
Abstract:SiC crystal substrate has been widely used in the area of microelectronics, photonics and new materials, such as semiconductor lighting,...
250