Paper Title:
Experimental Investigations of Silicon Wafer Grinding
  Abstract

The majority of integrated circuits are built on silicon wafers. To manufacture high-quality silicon wafers, a series of processes are needed. After a wire sawing process slices silicon ingots into wafers, grinding processes can be used to flatten the sliced wafers. This paper reports three experimental investigations on wafer grinding. The first investigation was to study the effectiveness of soft-pad grinding in removing the wire-sawing induced waviness. The second was to explore the capability of grinding in achieving super flatness. The third was to study the effects of grinding parameters on wafer flatness.

  Info
Periodical
Edited by
Dongming Guo, Tsunemoto Kuriyagawa, Jun Wang and Jun’ichi Tamaki
Pages
361-366
DOI
10.4028/www.scientific.net/KEM.329.361
Citation
J.H. Liu, Z. J. Pei, G. R. Fisher, "Experimental Investigations of Silicon Wafer Grinding ", Key Engineering Materials, Vol. 329, pp. 361-366, 2007
Online since
January 2007
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