The majority of integrated circuits are built on silicon wafers. To manufacture high-quality silicon wafers, a series of processes are needed. After a wire sawing process slices silicon ingots into wafers, grinding processes can be used to flatten the sliced wafers. This paper reports three experimental investigations on wafer grinding. The first investigation was to study the effectiveness of soft-pad grinding in removing the wire-sawing induced waviness. The second was to explore the capability of grinding in achieving super flatness. The third was to study the effects of grinding parameters on wafer flatness.